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  • 标题:Co-Simulation of PCB and Enclosure to Predict Radiated Emission
  • 本地全文:下载
  • 作者:Yifu Ding ; Yifu Ding ; Guangyu Zhang
  • 期刊名称:MATEC Web of Conferences
  • 电子版ISSN:2261-236X
  • 出版年度:2016
  • 卷号:77
  • 页码:1-4
  • DOI:10.1051/matecconf/20167702003
  • 语种:English
  • 出版社:EDP Sciences
  • 摘要:With highly requirement for electromagnetic compatibility (EMC) target, effective controlling of radiated emission of equipment or subsystem is of considerable significance. An emission equivalent model of Printed Circuit Board (PCB) is set up in this paper. Prediction of resonance characteristics, far field radiation of the PCB is carried out and analysed. Then, a 3-D model of a typical equipment enclosure is set up. Resonance characteristics and radiating characteristics of the enclosure is carried out and analysed. A co-simulation method to predict radiated emission is proposed and an example of co-design of PCB and enclosure using HFSS and Siwave verified this method.
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