首页    期刊浏览 2024年11月30日 星期六
登录注册

文章基本信息

  • 标题:Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
  • 本地全文:下载
  • 作者:M.I.I. Ramli ; M.I.I. Ramli ; M.A.A. Mohd Salleh
  • 期刊名称:MATEC Web of Conferences
  • 电子版ISSN:2261-236X
  • 出版年度:2016
  • 卷号:78
  • 页码:1-7
  • DOI:10.1051/matecconf/20167801064
  • 语种:English
  • 出版社:EDP Sciences
  • 摘要:The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %) were prepared via powder metallurgy (PM) technique. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of AC), the higher the shear strength of the joint. It is believed that the AC particles suppresses the interfacial IMC growth and thus improves the shear strength.
国家哲学社会科学文献中心版权所有