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  • 标题:Effect of Flux onto Intermetallic Compound Formation and Growth
  • 本地全文:下载
  • 作者:Siti Rabiatull Aisha Idris ; Siti Rabiatull Aisha Idris ; Noor Farihan
  • 期刊名称:MATEC Web of Conferences
  • 电子版ISSN:2261-236X
  • 出版年度:2016
  • 卷号:74
  • 页码:1-3
  • DOI:10.1051/matecconf/20167400034
  • 语种:English
  • 出版社:EDP Sciences
  • 摘要:In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn-3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C for up to 1000 hours. Results showed that fluxes significantly affect the IMC thickness and growth. In addition, during aging, the scallop and columnar morphology of IMC changed to a more planar type for both type of flux during isothermal aging. It was observed that the growth behavior of IMC was closely related to initial soldering condition.
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