摘要：A planar RF 4×4 microwave switch matrix has been proposed to reduce the size of traditional RF matrix at L-band, where multilayer microwave technique based on PCB is employed to integrate embedded power divider and RF interconnections. Buried components are simulated and optimized using 3D EM software to obtain good circuit performance. A prototype of the matrix is designed and fabricated on Arlon “CLTE-XT” substrate with “25N” prepreg. For all ports of the matrix and among the working band from 950MHz to 2150MHz, both input and output VSWR are less than 1.7, transmission gains are between 6.8 and 8, while ON-OFF isolations are better than 50 dB. The dimension of the matrix is not greater than 70mm×120mm×20mm, which is reduced by 2 order of magnitude compare with traditional design.
