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  • 标题:Performance of Formaldehyde Resins and Cement Bonded Particleboards and Understanding its Properties for further Advancement
  • 本地全文:下载
  • 作者:Ranjan Chaturvedi ; Asokan Pappu ; R. K. Mishra
  • 期刊名称:International Journal of Waste Resources
  • 电子版ISSN:2252-5211
  • 出版年度:2016
  • 卷号:6
  • 期号:2
  • DOI:10.4172/2252-5211.1000215
  • 语种:English
  • 出版社:OMICS International
  • 摘要:The objective of this study is to understand and articulate the impact of the mechanical properties of the particleboards made from different bonding system such as, urea formaldehyde, phenol formaldehyde, cement, polymeric methane diphenyl diisocyanate and PTP, containing raw materials from different wood species. It is evident from the detailed studies and data analysis of the work done that the maximum tensile modulus and flexural modulus of particleboard were 4616.3 MPa and 48.0 MPa respectively with thickness swelling 6.3% using urea formaldehyde resin. However with phenol formaldehyde resin the maximum tensile modulus and flexural modulus of particleboard were 5799.5 MPa and 35.14 MPa respectively with thickness swelling 3.9%. The cement bonded particleboard showed maximum tensile modulus and flexural modulus of 7121 MPa and 19.5 MPa respectively and the corresponding thickness swelling was 0.35%. Particleboard made with urea formaldehyde showed maximum value of thickness swelling while cement bonded particleboard showed maximum tensile modulus. Particleboards with urea formaldehyde and phenol formaldehyde resin showed almost comparable flexural modulus. This paper reviews the relationship of diverse parameters such as resin, hardener, raw material quantity as well as manufacturing conditions on the mechanical and physical properties of the particleboards, based on the published resources from the last 30 years.
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