摘要：AbstractDue to the miniaturization trend of the integrated circuit (IC), the ball grid array is an main interconnection method used for semiconductor packaging. Improving the reliability of the solder ball is gaining a significant pace as new materials are utilized to replace existing materials. Therefore, in this study, the stress response of BGA solder with different material during maximum vertical loading is analyzed through simulation. The stress response between two types of solder ball, Normal BGA and Micropearl BGA are compared. The simulation is done using ANSYS version 11. The results obtained show that the Normal BGA demonstrates higher stress response compared to the Micropearl BGA.
