摘要：The paper presents the results of research study on the phenomenon of friction of thin film electroconductive structure created on composite flexible substrate and results of measurement of the friction coefficient. Tribological tests were performed on T-01M tribotester. The measurement tests were conducted according to ASTM G133 standard with a minimum force of 1N. A ball-on-disc friction combination was used. The study was conducted at a fixed temperature of 28 ° C. Due to the nature of the tested samples, non-standard test parameters were used: test time 100 s, data acquisition frequency 10 Hz, slip velocity of the friction node 0.3 m/s on a radius of 11 mm. Based on the obtained results, the friction coefficient of the thin metallic layer Ag and Cu was determined. The obtained mean friction coefficient for a silver layer was 0.59, while for a thin copper layer 0.67. The knowledge of the determined coefficients will allow for effective and optimal use of the textronics materials tested in practical applications. The research methodology does not support determining the usage of the ball-on-disc pair.
