期刊名称：Current Journal of Applied Science and Technology
印刷版ISSN：2457-1024
出版年度：2015
卷号：9
期号：4
页码：360-373
语种：English
出版社：Sciencedomain International
摘要：This paper is focused on the dynamic analysis and simulation of a novel microgripper and its components: microcantilever and V-shape thermal actuator. These devices are designed on silicon and implemented on Professional Autodesk Inventor 2014. Simulations were realized using Ansys Workbench Software.This analysis is common for cantilever, and RF MEM devices, but it is has not been widely realized for other structures, such V-actuator and microgrippers.The analytical response was acquired with Steady-State Thermal, Static Structural, Modal and Harmonic Response modules.The dynamic behavior, resonance frequencies of each modal shape and the harmonic behavior with different damping factors of these devices are presented. Parameters as actuation forces, displacements, natural frequencies and specific displacement corresponding to each modal shape in all devices, are also considered in the analysis.The simulation results show the modal shapes of all analyzed devices, determining their respective modal frequencies and harmonic response. Damping factors of 1% to 10% were employed. The phase angle (±90º to ±105º) and attenuation levels due to damping were also obtained.
