摘要：In the mechatronic devices, the finite element analyses are the most used method to determine time-dependent solder joint fatigue response under accelerated temperature cycling conditions, the deterministic analyses are the most used methods. However, the design variables show variability and randomness which will affect the lifetime prediction quality. This paper focuses on solder joint reliability in tape-based chip-scale packages(CSP) with the consideration of uncertainties in material parameters.
