文章基本信息
- 标题:Solid-liquid Diffusion Interconnection Method Based on Cu-In Secondary Micro Nano Layer
- 本地全文:下载
- 作者:Jin Xiao ; Qian Zhai ; Bin Zhang 等
- 期刊名称:IOP Conference Series: Earth and Environmental Science
- 印刷版ISSN:1755-1307
- 电子版ISSN:1755-1315
- 出版年度:2020
- 卷号:585
- 期号:1
- DOI:10.1088/1755-1315/585/1/012147
- 语种:English
- 出版社:IOP Publishing