摘要：In modern integrated circuit manufacturing processes, wafers are always transported from one procedure to another. To reduce the risk of dust, Front Opening Unified Pod (FOUP) load-port system is always adopted. Misplaced wafers should be detected before transported. Traditional methods always fail to detect wafer states correctly. To improve detection accuracy, this paper proposed a vision based method. Wafer overlap and malposition detection approach based on modified YOLO-V3 algorithm was suggested. Experiment results shows superiority of the proposed approach.
