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  • 标题:Numerical Analysis of Thermal Management for High Power LED Array
  • 本地全文:下载
  • 作者:Yingdong Shen ; Junfeng Dai ; Yanlong Wang
  • 期刊名称:E3S Web of Conferences
  • 印刷版ISSN:2267-1242
  • 电子版ISSN:2267-1242
  • 出版年度:2021
  • 卷号:257
  • 页码:1-4
  • DOI:10.1051/e3sconf/202125701033
  • 语种:English
  • 出版社:EDP Sciences
  • 摘要:Adequate thermal management to remove and dissipate the heat produced by the LED is one of the main challenges in designing LED applications. In view of the above problems, this paper analyzed a heat sink as a heat exchanger for the LED array via the experiment combined with the numerical simulation. The results show that the heat sink is necessary for the LED array to guarantee reliable and safe operation. Moreover, the influence of the height of heat sink on the heat transfer of the LED array is also analyzed, and the optimized height of the heat sink for the 20W LED array is 20 mm. Considering the heat transfer and the manufacturing cost, increasing the heat sink area blindly is not the best way to reduce the LED junction temperature, and more specific work should be considered.
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