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  • 标题:Simulation Study on Low Thermal Resistance Materials to Improve Pipe-laying Cable Ampacity
  • 本地全文:下载
  • 作者:Yanfeng Wang ; Wenwei Zhu ; Yaodong Guo
  • 期刊名称:E3S Web of Conferences
  • 印刷版ISSN:2267-1242
  • 电子版ISSN:2267-1242
  • 出版年度:2021
  • 卷号:257
  • 页码:1-4
  • DOI:10.1051/e3sconf/202125701040
  • 语种:English
  • 出版社:EDP Sciences
  • 摘要:Pipe-laying cables have been widely used in the urban power transmission grid. The ampacity of the pipe-laying cables is affected by the thermal conductivity of the filling material, the ratio of the filling material and other factors. For this part of the content, the existing research is not enough. In this paper, a multi-field coupling model for pipe-laying cables is established and the validity of the proposed model is verified by the cable experiment. Based on the proposed multi-field model, three different filling materials have been compared and several influence factors have been investigated. Results show that the filling materials can significantly improve the heat dissipation environment in the pipe and increase the ampacity of the cable. Different filling materials, as well as their filling proportion in the pipe, will ultimately affect the ampacity of the cable. The results can provide guidance in practical engineering application.
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