摘要：The aim of this paper is to introduce and validate a new concept of testing smart connected devices (SCD) that have inertial measurement units (IMU) or gyroscopic and accelerometers, like smart bracelets, smart watches or even mobile phones after they have been assembled, in their way to the packaging area.The devices will be tested dynamically, while they travel on the conveyor using the IoT (Internet of Things) and some expected values for acceleration and angle variations. Using IoT to dynamically test electronic SCD, while they travel on a conveyor after the assembly process had been completed, will reduce the time to market and will exclude the need for a testing area. Once the SCD arrives at the packing area, the system will know and sort the device that are QA (Quality Assurance) passed or failed (the devices that will not send the expected values to the system).In order to prove this concept, we created a SCD that use an IMU connected to a Raspberry PI, boxed together. The PI is connected to ThingWorx (IoT platform that includes machine learning) and the box travel on different types of conveyor belts in order to validate this new concept.
