摘要：SummaryHeat dissipation materials in which fillers are dispersed in a polymer matrix typically do not exhibit both high thermal conductivity (k) and processability due to a trade-off. In this paper, we fabricate heat dissipation composites which overcome the trade-off using liquid metal (LM). By exceeding the conventional filler limit, ten times higherkis achieved for a 90 vol% LM composite compared withkof 50 vol% LM composite. Further, an even higherkis achieved by introducing h-BN between the LM droplets, and the highestkin this study was 17.1 W m−1K−1. The LM composite is processable at room temperature and used as inks for 3D printing. This combination of highkand processability not only allows heat dissipation materials to be processed on demand under ambient conditions but it also increases the surface area of the LM composite, which enables rapid heat dissipation.Graphical abstractDisplay OmittedHighlights•Liquid metal (LM) composites overcome thermal conductivity (k)-processability trade-off•High filler fraction and h-BN introduced between LM droplets result in highk•Concentrated LM composites are processable at room temperature and 3D printable•This combination of highkand processability enables rapid heat dissipationMaterials science; Materials chemistry; Materials application; Materials design
