期刊名称：Eastern-European Journal of Enterprise Technologies
印刷版ISSN：1729-3774
电子版ISSN：1729-4061
出版年度：2012
卷号：6
期号：11
页码：59-61
DOI：10.15587/1729-4061.2012.6013
语种：English
出版社：PC Technology Center
摘要：This paper presents work done to create a high power light emitted diode (LED) package on a PCB and a double layer FR4. Firstly, a detailed model of an LED package-on-substrate is created. Then the model is optimized with respect to kind, number and location of the thermal vias, width of thermal paths and LED power dissipation. The method CFD (computational fluid dynamics) via the software Mentor Graphics FLOEFD is used as a tool to assist in the design of the power LED for the real application. The results show that the models agree well with the actual measured value. A major advantage is saving time and money for the development of reliable design of LED modules.
