摘要：Technological analysis involves examining an object to understand how it works. In this article, we study how high school students proceed while they perform a technological analysis in technology classes. Based on observations and interviews with twelve students, our results show that they use at least three different ways to do so, which we have labelled: sequential dissection (completely disassemble the object, then try to understand how it works), system-based dissection (partially disassemble the object to understand how its systems fit together), and circular dissection (disassemble one piece at the time and try to understand its function).
关键词：technological analysis;mechanical dissection;science and technology
