期刊名称：Journal of Computational Science and Technology
电子版ISSN：1881-6894
出版年度：2013
卷号：7
期号：2
页码：265-277
DOI：10.1299/jcst.7.265
出版社：The Japan Society of Mechanical Engineers
摘要：There are two major methods, experimental and numerical approaches, for dealing with the strain and stress analysis essential to reliability assessment of electronic packaging. Both approaches are mutually complementary in view point of their assessment capability. In this paper, experimental and numerical simulation results for analyzing some reliability issues of electronic packages were reviewed, and the role of both approaches were discussed.
