摘要：The electronics is protected using plastic or metallic enclosures. Although, the electronics is protected by the enclosures from the surrounding environment, the moisture can still enter the enclosure via gasket, plastic enclosure walls, cable feedthroughs. The moisture existing inside enclosure may condense on PCBA or components due to a temperature changes or different temperature levels and can lead to a moisture-related failures. The temperature in the enclosure is also very dependent on the location and the heating of electronic components. Furthermore, the electronics can be mounted nearby to other heating or cooling components in the complex mechanical systems, such as water pump or water meter. The paper concerns the complex transient heat and mass transfer processes between two connected enclosures with one being warm and another cold. The objective of the paper is to develop an in-house code based on the RC approach for predicting and studying the temperature and moisture behaviour inside two connected enclosures. The developed RC model combines one-dimensional description and lumped analysis for heat and mass transport. The modelling of temperature and moisture response is carried out under non-isothermal B3 STANAG ambient conditions. Moreover, the effect of different material of warm enclosure and the heating are considered.
关键词：Heat and mass transfer;diffusion;solubility;absorption and desorption;RC approach;electronics enclosure
