出版社：Electronics and Telecommunications Research Institute
摘要：Polymeric multi-channel optical interconnection devices that are usually fabricated by transfer molding are indispensable for parallel interconnection in high speed, high capacity optical communication systems. This paper proposes a design technique considering the thermal behavior of materials, such as shrinkage and expansion during the molding process, to satisfy geometrical requirements that have less than 1 tolerance. We also designed molds considering the thermal effects of the materials and fabricated multi-channel optical fiber connectors that have less than 1 tolerance.
