出版社：Electronics and Telecommunications Research Institute
摘要：This paper describes the applicable method of part stress analysis failure rate prediction for electronic components in the MIL-HDBK-217D. The part stress analysis method requires the great amount of detailed informations, such as operating temperature, operating environment, etc. This paper calculates the failure rate of electronic components using the computer program. The program was written by Fortran V and has four basic units as follows (1) Raw data file (2) Failure rate calculation (3) Reliability modelling(Series only) (4) New data file The Functions and structure of the program are illustrated.
