期刊名称：International Journal of Hybrid Information Technology
印刷版ISSN：1738-9968
出版年度：2015
卷号：8
期号：8
页码：167-174
DOI：10.14257/ijhit.2015.8.8.16
出版社：SERSC
摘要：The main concern is over rising temperature during the testing of complex system-on- chip (SOC), this paper studies SOC wrapper and test access mechanism (TAM), and proposes an improved algorithm of TAM assignment under the constraints of temperature. The algorithm uses temperature superposition method and adds compression process. This algorithm can find the test structure that uses shorter test time
关键词：: TAM; thermal constraint; temperature superposition method; compression ; process
