期刊名称：International Journal of Security and Its Applications
印刷版ISSN：1738-9976
出版年度：2015
卷号：9
期号：6
页码：271-278
DOI：10.14257/ijsia.2015.9.6.26
出版社：SERSC
摘要：In this work, we are going to use thermal aware approach in Encoder design and also testing thermal stability by working on different ambient temperatures 298.15K, 308.15K, 318.15K, 328,15K, 338.15K and 348.15K and 358.15K. We have observe the compatibility of our device with wireless network by working on different I/O standards (LVCMOS15 and LVCMOS25) . There is 30.29% reduction in leakage power, when we scale down temperature from 358.15K to 298.15K using LVCMOS15 as I/O standard on 40nm Virtex FPGA. Leakage power is calculated for 65nm FPGA and 90nm FPGA as well .In this work, we are using Verilog Hardware Description Language.
关键词：Encoder; Internet of Things; FPGA; LVCMOS15; LVCMOS 25; Thermal ; Aware Design; Energy Efficient Design.abstract
