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文章基本信息

  • 标题:Development and Analysis of Milling Model Coupled Thermal-Mechanical
  • 本地全文:下载
  • 作者:Xiulin Sui ; Xinyang Liu ; Di Wang
  • 期刊名称:International Journal of Smart Home
  • 印刷版ISSN:1975-4094
  • 出版年度:2014
  • 卷号:8
  • 期号:2
  • 页码:211-216
  • DOI:10.14257/ijsh.2014.8.2.21
  • 出版社:SERSC
  • 摘要:Milling simulation is involved many key technologies, which are less researched on the chip separation criteria and coupled thermal conduction model. Because of the limitations of geometry, physics chip separation standard, this paper presented a 3D milling chip separation criteria and developed a coupled thermal conduction model by considering the milling temperature and the interaction effects of milling force. The results using AdvantEdge FEM finite element software for milling simulation showed that the numerical simulation analysis of cutting force obtained a good agreement with experimental results which verify the reasonableness of the 3D milling model coupled thermal-mechanical and laid the foundation for CNC milling simulation system.
  • 关键词:milling; coupled thermal-mechanical; chip separation criterion; simulation
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