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文章基本信息

  • 标题:Bandwidth Enhancement of Rectangular Array Using Cross Slots DGS Pattern in Ground Plane
  • 本地全文:下载
  • 作者:Lokeshwari Kartikey ; Sunil Kumar Singh
  • 期刊名称:International Journal of Innovative Research in Computer and Communication Engineering
  • 印刷版ISSN:2320-9798
  • 电子版ISSN:2320-9801
  • 出版年度:2014
  • 卷号:2
  • 期号:11
  • 出版社:S&S Publications
  • 摘要:A novel compact design for bandwidth enhancement of rectangular microstrip array is presented in thispaper. The basis for achieving the bandwidth enhancement is through metamaterial structure. Two types ofmetamaterial namely EBG and DSG are studied. Metamaterial structures are used for further antenna performanceimprovement, which suppress surface waves and improve the design characteristics. In this paper two cross slots cuts inthe ground plane, which enhance the bandwidth of reference antenna. This shape produces bandwidth ranging from15.30 GHz to 17.66 GHz, gives impedance bandwidth of 2.3649 GHz, whereas reference antenna without DSG ishaving impedance bandwidth of 290 MHz.
  • 关键词:Rectangular patch array; EBG; DGS; modified ground; Defected ground; HFSS-13.
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