期刊名称：International Journal of Innovative Research in Computer and Communication Engineering
印刷版ISSN：2320-9798
电子版ISSN：2320-9801
出版年度：2015
卷号：3
期号：9
DOI：10.15680/IJIRCCE.2015. 0309107
出版社：S&S Publications
摘要：The paper aims to study the importance of interconnect wires in deep-submicron semiconductortechnology , its impact on various parameters of VLSI circuits. The paper also discusses the introduction ofinterconnect wires , different types of interconnects used in various integrated circuits , interconnect material. How theresistance and inductance start including in the capacitance model of interconnect wires is also being explained. Thepaper also focuses on different wire model such as ideal wire , lumped model ,distributed RC model , transmission linemodel.
关键词：Interconnect ; Lumped model ;Distributed model ; Transmission line model
