期刊名称:International Journal of Innovative Research in Computer and Communication Engineering
印刷版ISSN:2320-9798
电子版ISSN:2320-9801
出版年度:2015
卷号:3
期号:9
DOI:10.15680/IJIRCCE.2015. 0309107
出版社:S&S Publications
摘要:The paper aims to study the importance of interconnect wires in deep-submicron semiconductortechnology , its impact on various parameters of VLSI circuits. The paper also discusses the introduction ofinterconnect wires , different types of interconnects used in various integrated circuits , interconnect material. How theresistance and inductance start including in the capacitance model of interconnect wires is also being explained. Thepaper also focuses on different wire model such as ideal wire , lumped model ,distributed RC model , transmission linemodel.
关键词:Interconnect ; Lumped model ;Distributed model ; Transmission line model