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  • 标题:Simulation Analysis of the Effects of Tool Rake Angle for Workpiece Temperature in Single Crystal Copper Nanometric Cutting Process
  • 本地全文:下载
  • 作者:Ge Jiang-hua ; Zhang Chun-tao ; Wang Ya-ping
  • 期刊名称:International Journal of Hybrid Information Technology
  • 印刷版ISSN:1738-9968
  • 出版年度:2016
  • 卷号:9
  • 期号:3
  • 页码:407-414
  • DOI:10.14257/ijhit.2016.9.3.38
  • 出版社:SERSC
  • 摘要:When the accuracy of the machined workpiece reaches to the nanometer scale, the atomic state in the cutting region 、 cutting force and the temperature of the workpiece newton layer must be analyzed from the atomic or molecular scale. Experiments will be difficult and time-consuming because the severe requirements of experiment for ultra-precision machine tool 、 resolution of detecting instrument and tool geometry, it becomes very difficult to study the effects of tool rake angle for nanometric cutting process and especially the workpiece temperature. Molecular dynamics simulation was used to carry out molecular dynamics modeling 、 simulation and analysis for diamond tools with different rake angle in single crystal copper surface nanometric cutting process, first of all, three-dimensional molecular dynamics simulation model of the workpiece and the tools with different rake angle were established; secondly, tools with different rake angle were used to machine the single crystal copper workpiece and calculated the CNA value of the workpiece atoms 、 the cutting force and the temperature of the workpiece newton; at last, the effect law of different tool rake angle for the atomic state in cutting region 、 cutting force variation and temperature of the workpiece newton in single crystal copper nanometric cutting process were analyzed. It was shown that when the rake angle value is negative, the increasing of temperature of workpiece newton with the increasing of the rake angle; when the rake angle value is positive, the decreasing of temperature of workpiece newton with the increasing of the rake angle.
  • 关键词:nanometric cutting; tool rake angle; molecular dynamics; cutting force; ; workpiece temperature
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