期刊名称：International Journal of Innovative Research in Science, Engineering and Technology
印刷版ISSN：2347-6710
电子版ISSN：2319-8753
出版年度：2014
卷号：3
期号：1
页码：8537
出版社：S&S Publications
摘要：The volume of data being transferred between on-chip functional blocks is rising fast due to the need forhigher resolution, greater CPU power. Moreover distributed multi-processor architectures require organised high-speedcommunication between processors. Metallic interconnect is highly inefficient in this role due to unachievable tradeoffsbetween design parameters and its performance deteriorates rapidly at frequency above 10 GHz due to skin effect anddielectric limitations. Optical interconnects are seen as a viable alternative to electrical interconnects The objective ofthe work is to model and then simulate the VCSEL based optical interconnect link. The model is based on multimoderate equations and it also accounts for the thermal dependence of a VCSEL’s behaviour. The power output of thesimulated link is then optimized with respect to parameters namely optical power and bias current. The methodologypresented here is suitable for investigation of both analog and digital modulation schemes but it primarily deals withdigital modulation.
关键词：Optical interconnections; Bit error rate; VCSEL’s; Optical receiver
