期刊名称：International Journal of Innovative Research in Science, Engineering and Technology
印刷版ISSN：2347-6710
电子版ISSN：2319-8753
出版年度：2014
卷号：3
期号：2
页码：9439
出版社：S&S Publications
摘要：Composition of Sn99.5-xCu0.5Bix has been examined as one of the lead free solder alloys and considered forsoldering in electronic packaging. The addition of bismuth to Tin improves the ductility and restrains the fillet lifting,which are problems of lead-free solders with Bi. Melting point of the samples were studied; the addition of Bismuth toSnCu0.5 binary alloy lowers the melting temperature. Wetting contact angle measurements of the Sn99.5 Cu0.5, Sn59.5Cu0.5Bi40, Sn54.5 Cu0.5Bi45 and Sn49.5 Cu0.5Bi50 rapidly solidified lead free solder alloys on CuZn30 substrate were carriedout at 573 K. The internal friction, elastic moduli, microhardness and the microstructure of the as-cast alloys at roomtemperature have been investigated. The examined physical properties are improved by increasing bismuth contents inthe studied lead free solder alloys. These improved properties indicate that these alloys are adequate for lowtemperature soldering applications.
关键词：Solder alloys; Young’s modulus; microhardness and wetting
