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  • 标题:Thermal & Hydraulic Characteristics of Single phase flow in Mini-channel for Electronic cooling – Review
  • 本地全文:下载
  • 作者:Keyur Thakkar ; Krishna Kumar ; Harshit Trivedi
  • 期刊名称:International Journal of Innovative Research in Science, Engineering and Technology
  • 印刷版ISSN:2347-6710
  • 电子版ISSN:2319-8753
  • 出版年度:2014
  • 卷号:3
  • 期号:2
  • 页码:9726
  • 出版社:S&S Publications
  • 摘要:Limitations of air cooling give motivation to apply liquid cooling for high heat flux dissipation because theintegrated circuits observe an exponential growth in number of transistors following the conjecture of Moore‟s Lawover last few decades. Micro/Mini channel is one of the candidates for high heat flux dissipation. To understandperformance of cooling at micro/mini scale, fluid flow & heat transfer need to study. The parameters which affect thebehaviour of fluid flow are mass flow rate, specific heat of fluid, geometry & Surface texture of channel would playmajor role over here. According to scaling law, as compactness increases, heat transfer increases & pressure dropdecreases. Increasing the hydraulic diameter from micro to mini scale configurations, we can get heat transfercoefficient sufficient at a relatively lower pressure drop for specific application. It is need to focus on applicability ofconventional correlation at this scale, and analyze reasons for deviation from experimental result. So, here single phaseliquid flow in mini channel is reviewed.
  • 关键词:Mini channel; Electronic cooling; Single phase laminar flow; Pressure drop; Surface texture
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