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  • 标题:Influence of Dithiocarbamate On Metal Complex and Thin Film Depositions
  • 本地全文:下载
  • 作者:P. BalaRamesh ; P. Venkatesh ; A. Abdul Jabbar
  • 期刊名称:International Journal of Innovative Research in Science, Engineering and Technology
  • 印刷版ISSN:2347-6710
  • 电子版ISSN:2319-8753
  • 出版年度:2014
  • 卷号:3
  • 期号:8
  • 页码:15301
  • DOI:10.15680/IJIRSET.2014.0308033
  • 出版社:S&S Publications
  • 摘要:This article focuses on the effects and applications of ethylenediamine dithiocarbamate (EDADTC) on coordinationand electro chemistry. EDADTC shows stable palladium (II) metal complex in organosulphur chemistry. Sincethey have soft sulphur donor atoms can make a strong metal binding property, act as the ligand and stable above pH 12.Due to their water soluble tendency, flow of electron from alkyl group to nitrogen, inductive effect and conjugation effectproved the stabilizing property in electroless plating process. EDADTC has improved the physical property and producethe quality deposits in electroless copper plating process. The palladium (II) metal complex was characterized by RapidElemental Analysis. The structure of the stable complex was confirmed with Electronic and I.R Spectral Analysis. Thesurface morphologies of copper deposits were characterized by AFM studies. The crystallite sizes of the copper depositswere measured by XRD studies and the quality of the copper deposits was investigated by cyclic voltammetry studies.
  • 关键词:conjugation effect; copper deposits; crystallite sites; ligand; surface morphology
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