期刊名称：International Journal of Innovative Research in Science, Engineering and Technology
印刷版ISSN：2347-6710
电子版ISSN：2319-8753
出版年度：2014
期号：ICETS
页码：1503
出版社：S&S Publications
摘要：The main aim of this analysis is to studythe effect of bonding strength between metal andceramic at different processing temperature andholding time. The Al/SiC bonding was modelled andanalyzed using finite element analysis in ANSYSsoftware. The different values of coefficients of linearthermal expansion (CTEs) of the metal and ceramicare induces more thermal stress at the interface. Themismatch of thermal stress at the interface regionplays an important role in improving bondingstrength. Hence, it is essential to study and evaluatethe interface bonding in metal-ceramics joints.
关键词：Bonding strength; Coefficient of thermal;expansion; Thermal stress; Interface
