期刊名称：International Journal of Innovative Research in Science, Engineering and Technology
印刷版ISSN：2347-6710
电子版ISSN：2319-8753
出版年度：2016
卷号：5
期号：4
页码：5613
DOI：10.15680/IJIRSET.2016.0504070
出版社：S&S Publications
摘要：Microprocessor has become the heart of home/office PC systems. The microprocessor device requireelectrical energy for their work, the electrical energy is converted into heat energy this may affect the performance of amicroprocessor. Heat sink was used to control the temperature of microprocessor in permissible limit. There are variousparameters like heat sink material, fin thickness, number of fins, spacing between two fins, base plate thickness and finshape etc. which affects the performance of heat sink. Material is one of the parameter that increase heat transfer rate. Ifcopper is used in place of aluminium then heat transfer rate increases but at the same time cost also increases. The heatsink base plate thickness is parameter for improvement. When the base plate thickness was increased, the heat sinkperformed better. However, there are space limitations for every heat sink in a computer. Also the increase in numberof fin was not a solution for improving heat transfer. So the fin shape is the parameter which can be studied in this workfor better results. The work consists of numerical study of different fin profile heat sinks which are rectangular,circular, trapezoidal and triangular using ANSYS. The numerical results were validated with experimental test setup forrectangular fin shape heat sink. Validated numerical result signifies that the more heat transfer rate for triangular fin. Sothe modified triangular fin heat sink was fabricated and can be checked experimentally to get better results. Themodified triangular heat sink shows that there was increase in heat transfer rate by 9% as compare to rectangular finheat sink.
