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  • 标题:Thermal Analysis of Heat Dissipating Electronic Devices
  • 本地全文:下载
  • 作者:Amjad Khan ; Abdul Razak Kaladgi ; Sushma S
  • 期刊名称:International Journal of Innovative Research in Science, Engineering and Technology
  • 印刷版ISSN:2347-6710
  • 电子版ISSN:2319-8753
  • 出版年度:2016
  • 卷号:5
  • 期号:5
  • 页码:7776
  • DOI:10.15680/IJIRSET.2016.0505194
  • 出版社:S&S Publications
  • 摘要:The rapid increase in the growth and advancement of electronic technology leads to the miniaturizationof the devices. As the compactness of the device increases the problem of heat transfer also increases. There is alimitation for the cooling with air in the devices with high heat dissipation. The compactness and limitation in aircooling forces the use of Minichannel and use of liquid coolants. The main aim of this work is to carryoutexperimentally, the heat transfer analysis of Square Minichannel (used as a heat sink) cooled with RO treated water.The study was conducted under turbulent, steady and forced flow condition. The important parameters of interest likeReynolds’s number, Nusselt number, friction factor, and pressure drop were calculated. From the obtained results, itwas clearly observed that within the entry region, both local heat transfers coefficient and friction factor increases andafter a short distance it becomes constant. Also with increase in Reynolds number, pressure drop increases. Henceenhancement does occurat the cost of pumping power.
  • 关键词:Electronic devices; Square Minichannel; Turbulent flow; RO treated water.
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