期刊名称：International Journal of Innovative Research in Science, Engineering and Technology
印刷版ISSN：2347-6710
电子版ISSN：2319-8753
出版年度：2016
卷号：5
期号：5
页码：8407
DOI：10.15680/IJIRSET.2016.0505284
出版社：S&S Publications
摘要：This research work provides an overview of developments, challenges with respect to design, modeling,simulation and analysis of MEMS pressure sensors. Recently MEMS capacitive pressure sensors have gainedadvantages over piezoresistive pressure sensor due to high sensitivity, low power consumption, invariance oftemperature effects. As theses sensors application range is increasing, it is essential to review the technologicaldevelopments and future scope of MEMS capacitive pressure sensor.This Research Work describes performance analysis of a capacitive pressure sensor working on electro-mechanicsinterface. Capacitive pressure sensors are advantageous over their counterpart piezoresistive sensors as they consumeless power, low sensitivity to temperature, high overpressure capability and high resistance to pressure shocks,improved long term stability, high operating temperature and ease of packaging. In this work, simulation andperformance evaluation of electrical and mechanical effects of MEMS based capacitive pressure sensor with squarediaphragm using COMSOL Multiphysics is described. This includes diaphragm deflection, sensitivity and linearityanalysis, capacitance vs. pressure analysis and thermal considerations. The values of diaphragm displacement andcapacitance are plotted under uniform external pressure 25kPa.Two materials are analysed silicon,&graphene andgraphene has shown the best and stable result. The simulation results compare the capacitance values with linearizedanalytical capacitance under same external pressure. The effect of packaging stress on MEMS design process is alsoemphasized in the paper. It also describes comparison of sensitivity of capacitive pressure sensor with and withoutpackaging stress.
