期刊名称：TELKOMNIKA (Telecommunication Computing Electronics and Control)
印刷版ISSN：2302-9293
出版年度：2016
卷号：14
期号：1
页码：262-272
DOI：10.12928/telkomnika.v14i1.2030
语种：English
出版社：Universitas Ahmad Dahlan
摘要：This paper presents the computational of two-way fluid structure interaction technique by using Mesh based Parallel Code Coupling Interface for the visualization of wiresweep in the electronics packaging. Polymer rheology models with Castro-Macosko model have been used in the fluid flow model and Volume of Fluid technique was applied to melt front tracking of the fluid. The numerical analysis used User-Defined Function to allow curing kinetic model. Wiresweep profiles and pressure distribution within the mold are presented. The numerical results of melt front patterns and filled volume were compared with the previous experimental results and found in good agreement.
其他摘要：This paper presents the computational of two-way fluid structure interaction technique by using Mesh based Parallel Code Coupling Interface for the visualization of wiresweep in the electronics packaging. Polymer rheology models with Castro-Macosko model have been used in the fluid flow model and Volume of Fluid technique was applied to melt front tracking of the fluid. The numerical analysis used User-Defined Function to allow curing kinetic model. Wiresweep profiles and pressure distribution within the mold are presented. The numerical results of melt front patterns and filled volume were compared with the previous experimental results and found in good agreement.
