期刊名称：International Journal of Electrical and Computer Engineering
电子版ISSN：2088-8708
出版年度：2016
卷号：6
期号：6
页码：3142-3147
DOI：10.11591/ijece.v6i6.pp3142-3147
语种：English
出版社：Institute of Advanced Engineering and Science (IAES)
摘要：Many small- and medium-sized car-part manufacturers are either still managing their mold manually or rarely managing it, and therefore, experience significant manufacturing cost and loss in time. In such a situation, a module has been developed in the present work which can count the number of mold used. Such a module is extremely important for small and medium-sized enterprises (SMEs) applying which in the production line they will be able to manage the mold life cycle and improve product quality. This is expected to have both direct and indirect effects on their business activities. The developed system uses a photo sensor, distance measurement sensor, Atmega128 MCU, tablet pc and Bluetooth communication module. The actual module developed in this study was set up on a molding equipment for test and data were collected using an existing tablet PC. The test showed that the number of shots increased when the upper mold touched the lower mold. The maximum and minimum value between the upper and lower molds could be adjusted with the automatic mold shot measurement and management system. Therefore, any molding equipment with various upper-lower gaps will be able to apply the newly developed system.
其他摘要：Many small- and medium-sized car-part manufacturers are either still managing their mold manually or rarely managing it, and therefore, experience significant manufacturing cost and loss in time. In such a situation, a module has been developed in the present work which can count the number of mold used. Such a module is extremely important for small and medium-sized enterprises (SMEs) applying which in the production line they will be able to manage the mold life cycle and improve product quality. This is expected to have both direct and indirect effects on their business activities. The developed system uses a photo sensor, distance measurement sensor, Atmega128 MCU, tablet pc and Bluetooth communication module. The actual module developed in this study was set up on a molding equipment for test and data were collected using an existing tablet PC. The test showed that the number of shots increased when the upper mold touched the lower mold. The maximum and minimum value between the upper and lower molds could be adjusted with the automatic mold shot measurement and management system. Therefore, any molding equipment with various upper-lower gaps will be able to apply the newly developed system.
