摘要：In this study, a compact 100-W input power light-emitting diode array vapor chamber–based plate has been fabricated to investigate the thermal performance. To make a comparison, a typical commercial chip on board–type light-emitting diode array using a copper-based plate which has the same chip layout and the same power input was also investigated. The surface temperature distribution and total thermal resistance corresponding to these two high-power light-emitting diode modules were measured using a thermal infrared camera and a MicReD T3Ster. The experimental results show that the thermal performance of the compact light-emitting diode array using vapor chamber–based plate is much better than that using copper-based plate. The average temperatures of light-emitting diode copper- and vapor chamber–based plates are 100.5°C and 41.5°C at 100 W power input, respectively. In addition, the maximal temperature difference of the 100-W light-emitting diode array vapor chamber–based plate is 2.2°C far less than 31.7°C of copper-based plate. Furthermore, the measurement results show that the vapor chamber can prominently lower the spreading resistance, diminish the hot-spot effect, and increase durability.
