摘要：The removal mechanism of silicon nitride ceramic under high-speed grinding is studied in this article, and grinding parameters are optimized. The efficiency of grinding is improved. The diamond grains of grinding wheel are simplified into the truncated octahedron and cone to simulate the grinding process. When the ceramic workpiece is grinded by single-diamond grain and continuously grinded by multi-diamond grains, the effects of grinding depth and grinding speed on grinding force and surface morphology are analyzed. Through the grinding experiment of the inner surface of silicon nitride ceramic, the grinding force data and surface morphology images were obtained. It proves that at the process of studying the effect of grinding speed on the grinding force and machining surface quality, the results of simulation using multi-diamond grains are closer to the experimental results. The results prove that by increasing wheel speed or lowering grinding depth, the grinding force would be reduced and the quality of grinding surface would be improved. Between grinding depth and grinding speed, the latter factor has a greater impact on grinding force and the quality of grinding surface.
