期刊名称：Proceedings of the National Academy of Sciences
印刷版ISSN：0027-8424
电子版ISSN：1091-6490
出版年度：2004
卷号：101
期号：35
页码：12814-12817
DOI：10.1073/pnas.0404437101
语种：English
出版社：The National Academy of Sciences of the United States of America
摘要：We demonstrate the fabrication of packaged microsystems that contain active semiconductor devices and passive components by using a directed self-assembly technique. The directed self-assembly is accomplished by combining geometrical shape recognition with site-specific binding involving liquid solder. Microfabricated components with matching complementary shapes, circuits, and liquid solder-coated areas were suspended in ethylene glycol and agitated by using a turbulent liquid flow to initiate the self-assembly. Microsystems were obtained by sequentially adding components of different types. Six hundred AlGaInP/GaAs light-emitting diode segments with a chip size of 200 {micro}m were assembled onto device carriers with a yield of 100% in 2 min. Packaged light-emitting diodes formed with yields exceeding 97% as a result of two self-assembly steps in 4 min. This self-assembly procedure, based on geometrical shape recognition and subsequent binding to form mechanical and electrical connections, provides a high distinguishing power between different components and a route to nonrobotic parallel assembly of electrically functional hybrid microsystems in three dimensions.
