期刊名称：International Journal of Networking and Computing
印刷版ISSN：2185-2847
出版年度：2018
卷号：8
期号：1
页码：124-139
语种：English
出版社：International Journal of Networking and Computing
摘要：A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, we have developed intellectual properties (IPs), and proposed an interconnection network which can make the use of IPs. We also developed a real chip embedded the IP, and evaluated the performance. By stacking multiple chips with the proposed IP, an inter-chip network with link-to-link flow control by piggyback control is established. The new proposed escalator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control was less than 3%-4% of that without control messages.
其他摘要：A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, we have developed intellectual properties (IPs), and proposed an interconnection network which can make the use of IPs. We also developed a real chip embedded the IP, and evaluated the performance. By stacking multiple chips with the proposed IP, an inter-chip network with link-to-link flow control by piggyback control is established. The new proposed escalator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control was less than 3%-4% of that without control messages.
