期刊名称：International Journal of Computer Science Issues
印刷版ISSN：1694-0784
电子版ISSN：1694-0814
出版年度：2013
卷号：10
期号：3
出版社：IJCSI Press
摘要：As the signal frequency increases, the accurate and fast modeling for vias structure in multi-layer substrate is very important to performance analysis of high speed circuit. According to the skin effect and RL ladder circuit model, the equivalent circuit of via base on structural segmentation is presented in this paper. Vias structure is decomposed into some segmented sub-structure based on the routing layer. The equivalent circuit of each sub-structure is modeled on the basis of RL ladder circuit and numerical calculation method. And then, a complete equivalent circuit of the entire vias structure is modeled. Meanwhile, the equivalent circuit model of two adjacent via structure is established with coupling capacitance and coupled inductor. Finally, the simulation results of the equivalent circuit model in this paper are agreed to the results gained from HFSS within 8GHZ.
