期刊名称：International Journal of Innovative Research in Science, Engineering and Technology
印刷版ISSN：2347-6710
电子版ISSN：2319-8753
出版年度：2018
卷号：7
期号：2
页码：1255
DOI：10.15680/IJIRSET.2018.0702036
出版社：S&S Publications
摘要：Tin-Silver (Sn-Ag) lead free alloys were the first lead free product applied as substitutes over Tin-Lead(Sn-Pb) eutectic solders which have a long history of use in electronics industry. Creep Resistance of the solder joint isone of significant mechanical properties which play an important role in determining its long term reliability as jointsare subjected to high level of strains during operation. The aim of this study is to improve the creep life of 96.5Sn3.5Agwt% solder alloy at 25°C by doping it with RE element, Lanthanum (La). The obtained results revealed that creep lifeof 96.0Sn3.5Ag0.5La wt% has been significantly improved (100%) when compared with 96.5Sn3.5Ag wt% at aconstant stress of 18MPa. Micro structural evaluation has not been focused.
关键词：Lead Free Solder; Lanthanum; Electron Dispersive Spectroscopy; Creep
