期刊名称：IOP Conference Series: Earth and Environmental Science
印刷版ISSN：1755-1307
电子版ISSN：1755-1315
出版年度：2018
卷号：170
期号：4
页码：042066
DOI：10.1088/1755-1315/170/4/042066
语种：English
出版社：IOP Publishing
摘要：The interfacial intermetallic compounds (IMCs) layer of Sn-58Bi lead-free solder reacting with Cu substrate were explored at aging stage after soldering for 1day, 3days, 6days, 8days and 10days, respectively. Results show that Bi doesn't react with Cu atoms or Sn atoms. The IMCs layer is composed of Cu6Sn5 phase and Cu3Sn phase. The IMCs layer evolves from scalloped shape to layer shape with addition of aging time, meanwhile, Bi phase in matrix grows bigger. The growth kinetic equation of IMCs layer is obtained and described as X=1.06+0.69t1/2, where 0.69μm/d1/2 is the growth coefficient. Compared with Sn-3Ag-0.5Cu lead-free solder, the growth coefficient of Sn-58Bi solder is much smaller. Accordingly, the growth of IMCs layer of Sn-58Bi solder is more slowly than that of Sn-3Ag-0.5 Cu solder.
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