摘要：A series of polyimides (PI) containing bridged linkages were prepared successfully through a three-step technique. The results indicated that the glass transition temperature () of polyimides was affected by flexibility of polymer chain and the intermolecular interactions. ODPA-TPER-based polyimide possesses the lowest , which was 214°C. All polyimides had semicrystalline characteristics, and ODPA-TPER-based PI exhibited the lowest melting temperature () at 316°C. The polyimides had high weight loss temperatures, which indicated that bridged linkages can reduce the softening temperature, meanwhile keeping excellent thermal stability.
