期刊名称：IOP Conference Series: Earth and Environmental Science
印刷版ISSN：1755-1307
电子版ISSN：1755-1315
出版年度：2019
卷号：233
期号：2
页码：022010
DOI：10.1088/1755-1315/233/2/022010
出版社：IOP Publishing
摘要：A Cu–2.5%Sn alloy was fabricated by continuous unidirectional solidification (CUS). The EBSD was used to analyse the microstructure of CSU Cu–2.5%Sn alloy. The results show that the alloy is composed of coarse columnar grains, which grow along the direction of [001] and [101], and the average diameter of the columnar grains is about 470 μm. Most of grain boundaries between the columnar grains are small-angle and the rest are high-angle grain boundaries. It is also found that the CUS Cu–2.5%Sn alloy has strong {110} <110> texture and cubic texture.
