文章基本信息
- 标题：Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current
- 本地全文：下载
- 作者：Jiayun Feng ; Chunjin Hang ; Yanhong Tian 等
- 期刊名称：Scientific Reports
- 电子版ISSN：2045-2322
- 出版年度：2018
- 卷号：8
- 期号：1
- 页码：1775
- DOI：10.1038/s41598-018-20100-1
- 语种：English
- 出版社：Springer Nature
- 摘要：-based joint could achieve comparable shear strength with Sn-based joint.
