文章基本信息

标题：Mentor certified for latest TSMC 5nm FinFET process and innovative TSMC-SoIC 3D chip stacking technology
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作者：Mentor, a Siemens business
期刊名称：PR Newswire
出版年度：2019
卷号：Apr 23, 2019
出版社：PR Newswire Association LLC