摘要：Environmental dust particles repelling from a hydrophobic surface under the electrostatic influence are considered and the dynamics of the dust particles are analyzed incorporating the high speed camera. The velocity of the repelled dust particles are formulated using the force balance incorporating the forces associated with the electrostatic repulsion, particle adhesion, particle drag, and the inflight particles interaction under the charge influence. The functionalized silica particles are deposited on the glass surface towards achieving a hydrophobic wetting state on the surface. An electronic circuitry is designed and built while generating the electrostatic effect, in the pulse form, on the dust particles located on the surface of the hydrophobic plate. Findings revealed that functionalized silica particles deposited surface results in hydrophobic wetting state with contact angle in the order of 158° ± 2° and contact angle hysteresis of 2° ± 1°. The electrostatic impulsive force generated on the plate surface enables to repel most of the sizes of the dust particles; however, some of the small dust particles remain as the residues on the surface after the electrostatic influence. The dust particle velocity predicted from the analytical formulation agrees with that obtained from the high speed camera data. The pinning force of the small size particles (0.6 µm≤), due to adhesion on the surface, is found to be larger than the average size particles (∼1.2 µm), which in turn, suppresses these particles repelling from the surface under the electrostatic influence. The residues of the dust particles on the as received glass surface after dust repelling are more than those residues on the hydrophobic surface. This behavior is associated with the dust particles adhesion on the surface. Consequently, hydrophobic wetting state on the plate surface improves the dust particle repelling from the surface.
