摘要：Micrometer copper columns were fabricated via a technology named localized electrochemical deposition (LECD). This paper studies the effects of applied potential and the initial gap between electrodes on the LECD process. The surface and cross sectional morphologies, as well as the average deposition rate were investigated to evaluate the quality of the deposited copper columns. Results demonstrated that the copper columns tended to be cylinder-shape with few voids inside at lower potential (<2.4 V). Whereas,the copper columns tended to be dendriform-shape with lots of voids inside at larger potential (>2.8 V). The average deposition rate increased with the raise of potential. In addition, the copper columns tended to be cylinder-shape with the initial gap between electrodes to be 10 μm or below. However, the copper columns tended to be cone-shape when the initial gap between electrodes became larger (35 μm or above). The number of voids inside the copper column and the average deposition rate both decreased with the increase of the initial gap. Moreover, the process of LECD under varied electric field has also been simulated using COMSOL software, and the formation of cylindrical and conical copper columns was further explained based on the electric field distribution at the cathode.
